Scope of the Grant
National Science Foundation (NSF) Student Grant Awards will directly cover the full registration fee and hotel accommodation in double-occupancy.
The grant includes:
- Access to all POWDERMET and AMPM technical presentations
- Exhibition admission
- Conference proceedings
- Opening Night Reception
- Opening General Session
- Design Excellence Awards and Industry Recognition luncheons
- Closing event
- Exhibition admission
- Registration bag with handouts
- Double-occupancy hotel accommodations for 3-nights
- Attend the entire conference (Sunday–Wednesday). Please make your travel plans accordingly.
Recipients are responsible for the cost of their own transportation and meals outside of the included conference events.
The conference registration deadline for awardees is March 31st
Please note that a requirement is the preparation of a project poster to be displayed at the conference and a 10-minute synopsis of the poster in the form of a PowerPoint presentation during a scheduled Grant TNT: Talk ‘N Technology poster session. This requirement is designed to further enhance the student’s conference experience.
Please email Stephanie Schember, or call 609-452-7700 ext. 114, with any questions.
Download the Poster and Presentation Requirements
MPIF is grateful to the National Science Foundation for its support of students to attend the POWDERMET2019 & AMPM2019 annual conferences. This support provides student participants with opportunities to exchange ideas with leading researchers and engineers from worldwide industrial and governmental facilities, as well as with students and faculty from both domestic and international universities. Student participants will learn the latest research areas and results in powder metallurgy fields of interest. These opportunities will not only improve the students’ knowledge in the field, but also develop scientists and engineers who are ideally suited to create the next generation of designs in powder metallurgy and metal additive manufacturing that will push materials and manufacturing capabilities.