The Metal Powder Industries Federation (MPIF), with the aid of powder metallurgy (PM) industry leaders, has released an updated version of the PM Industry Roadmap. Due to significant technological advancements over the past five years, the 2017 PM Industry Roadmap has been updated to provide a detailed research agenda for the industry. This document addresses the vision for the PM industry, and includes a view of future customer and market expectations, as well as the goals designed to meet those expectations.
With POWDERMET2017 and AMPM2017 just around the corner, the powder metallurgy (PM) industry is packing bags and hopping flights to the bright city lights of the famous Las Vegas Strip. What is on the agenda for attendees this year?
The powder metallurgy (PM) industry's longest running course, the Basic PM Short Course, is back this year to bring together employees seeking to enhance their depth of PM knowledge and advance their careers. Held at Penn Stater Conference Center Hotel, State College, Pa., August 15–17, 2017, this is the ideal place to delve into PM and an excellent opportunity to ask industry experts questions on this innovative technology.
"Introducing Powder Metallurgy and the PM Industry," the first video in a series of four educational videos focused on PM, has been released by the Metal Powder Industries Federation (MPIF). The video is hosted by industry leader John Engquist, FAPMI, past president of the Center for Powder Metallurgy Technology (CPMT), and covers a brief history of PM, followed by a discussion on market segments, common applications, the technical advantages of using PM, and a brief overview of PM processes.
Lightweight Innovations for Tomorrow and America Makes, the National Additive Manufacturing Innovation Institute, have announced an initiative with Cincinnati State Technical and Community College (CSTCC) to develop an open-source curriculum to provide both incumbent workers and new students with knowledge and hands-on training in advanced lightweight additive manufacturing.